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02 / MATERIAL

Performance, made tangible.

A mycelium composite for building insulation. Explore the V2 thermal result, calculated thermal resistance and the next technical priorities.

FungiFoam prototype panel surface and edges
FungiFoam / Prototype panel

PERFORMANCE SNAPSHOT

≈0.040W/(m·K)

Thermal conductivity λ

Experimental V2 result

Prototype generation
V2 developed
Development generation
V3 in progress

Building science / calculated values

What does 0.04 mean in a wall?

Thermal conductivity describes how readily heat passes through a material. A lower value means less heat transfer for the same thickness. Thermal resistance also accounts for thickness.

R = d / λ λ ≈ 0.04 W/(m·K)
Indicative material thermal resistance
ThicknessR · m²K/W
50 mm1.25
100 mm2.50
150 mm3.75
200 mm5.00

Indicative calculations using the experimental V2 λ value, not declared product values. They exclude other wall layers, surface resistances and thermal bridges.

TECHNICAL OVERVIEW

The material data programme.

Thermal conductivity

λ ≈ 0.040 W/(m·K)

Experimental V2 result

Thermal resistance

R = d / λ

Indicative calculations above

Density

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Testing programme

Compressive performance

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Testing programme

Dimensional stability

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Testing programme

Water absorption

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Testing programme

Water vapour behaviour

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Testing programme

Reaction to fire

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Testing programme

Acoustic performance

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Testing programme

Durability

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Testing programme

Bio-based content

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Testing programme

Life-cycle impact / kgCO₂e

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Testing programme

Product dimensions

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Testing programme

Programme fields describe the data we are developing. Values will be published with their methods and material version.

Technical context and roadmap

Material ambition. Shared.

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